Windows 10&11 - RHEL 8 - Ubuntu 20.04 - Thermo Scientific License Manager (TLM)
Before downloading Open Inventor 2023.2.3, please read the release notes to find out what's new and check the system requirements.
This version of Open Inventor uses the Thermo Scientific License Manager (TLM) and Thermo Scientific License Manager for Server (TLMs) tools.

Windows 10&11

For Windows, we provide the SDK as both an executable installer ('EXE' link) and a simple ZIP file. If this is the first time you are installing Open Inventor, for example evaluation or new customer, then we recommend clicking the EXE link. The installer will automatically set the environment variables that you need to build and run Open Inventor applications. Current customers can also use this link, but may wish to download and unpack the .zip file to avoid changing their current environment. If you download the .zip file, you will need to set up your build environment yourself. In any case, please read the document Windows installation procedure.

 

C++ (Follow the installation procedure) 64-bit
 Open Inventor 2023.2.3 C++ for Visual Studio 2022 EXE | ZIP
 Open Inventor 2023.2.3 C++ for Visual Studio 2017 or 2019 EXE | ZIP

JAVA (Follow the installation procedure) 64-bit
 Open Inventor 2023.2.3 Java for OpenJDK 11 EXE | ZIP

.NET (Follow the installation procedure) 64-bit
 Open Inventor 2023.2.3 .NET6 for Visual Studio 2022 (PREVIEW) EXE | ZIP
 Open Inventor 2023.2.3 Framework 4.7 for Visual Studio 2017, 2019 or 2022 EXE | ZIP

RHEL 8

C++ (Follow the installation procedure) 64-bit
 Open Inventor 2023.2.3 C++ for gcc 8 TAR.GZ

JAVA (Follow the installation procedure) 64-bit
 Open Inventor 2023.2.3 Java for OpenJDK 11 TAR.GZ

Ubuntu 20.04

C++ (Follow the installation procedure) 64-bit
 Open Inventor 2023.2.3 C++ for gcc 9 TAR.GZ
C++ Headless* (Follow the installation procedure) 64-bit
 Open Inventor 2023.2.3 C++ for gcc 9 TAR.GZ

JAVA (Follow the installation procedure) 64-bit
 Open Inventor 2023.2.3 Java for OpenJDK 11 TAR.GZ
JAVA Headless* (Follow the installation procedure) 64-bit
 Open Inventor 2023.2.3 Java for OpenJDK 11 TAR.GZ

 

* The Headless package provides an implementation of Open Inventor specifically for "headless" server machines. It uses the EGL library, instead of GLX, allowing Open Inventor RemoteViz services to be deployed and run without an X Server (X11). Compared to the standard package, there are some limitations:
  • Classical viewer classes are not provided.
  • RemoteViz viewer components must be used.
  • Standard example programs, except for RemoteViz, are not provided.
  • If you need examples for Open Inventor, VolumeViz, etc. please also download the standard SDK package.
  • The DialogViz extension is not provided.

Licensing tools

This version of Open Inventor introduces the Thermo Scientific License Manager (TLM) and Thermo Scientific License Manager for Server (TLMs) tools. Those tools are designed to gradually replace manual license installation steps, providing a unified and much user friendly experience, both for node locked or Flexnet TM server-based licenses.
Read the licensing documentation to find out how to activate your licenses and use those tools.